By Kash L. Mittal
This e-book files the lawsuits of the Second foreign Symposium on Adhesion dimension of movies and Coatings, held in Newark, NJ, October 25-27, 1999. because the First Symposium (Boston 1992) there have been significant job in devising new, extra trustworthy and extra effective how you can degree adhesion of movies and coatings, which led to the choice to prepare the Newark Symposium. movies and coatings are used for quite a few reasons Гўв‚¬вЂњ sensible, ornamental, protecting, and so on. Гўв‚¬вЂњ in a bunch of purposes. without reference to the aim or program of a movie or a coating, their enough adhesion to the underlying substrates is of paramount significance. Concomitantly, the necessity to advance recommendations for quantitative review of adhesion of movies and coatings is all too seen. This quantity features a overall of 20 papers, that have all been conscientiously peer reviewed and certainly transformed earlier than inclusion. the themes contain: dimension and research of interface adhesion; relative adhesion dimension for skinny movie constructions; adhesion checking out of demanding coatings via quite a few recommendations; demanding situations and new instructions in scratch adhesion checking out of lined substrates; program of scratch try to diverse movies and coatings; overview of coating-substrate adhesion via indentation experiments; size of interfacial fracture strength in multifilm functions; laser precipitated decohesion spectroscopy (LIDS) for measuring adhesion; pulsed laser procedure for evaluate of adhesion; blade adhesion try; JKR adhesion attempt; coefficient of thermal enlargement size; and residual stresses in diamond motion pictures. This quantity, supplying the most recent info, can be of significant price and curiosity to someone operating within the zone of adhesion dimension of flicks and coatings.
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Extra resources for Adhesion Measurement of Films & Coatings Vol.2
The cracks in the residual PI are perpendicular to the main peel crack path as well as perpendicular to the peel direction, which is marked in the figure. Relative adhesion measurement for thin film microelectronic structures 31 RESIDUAL P I PHASE LAYER Figure 10. Cross-sectional SEM analysis of peeled metal film from a Cu/phase layer (adhesion promoting 1ayer)lTiWIPI test sample. Note the secondary cracking (crack branching) extending through the more brittle metal films and blunting into the more ductile Cu .
P. S. Oh, and J. , 5,333 (1991). 57. H. S. Kim, I d . J. Solids Structures, 30, 1789 (1993). 58. P. Adhesion Sci. , 7, 941 (1993). 59. P. L. W. 147, VSP, Utrecht, The Netherlands (1997). 60. O. D Thesis, Massachusetts Institute of Technology (1995). Relative adhesion measurement for thin film microelectronic structures 47 61. L. D Thesis, University of Massachusetts, Amherst (1988). 62. L. O. H. 503, Plenum, New York (1980). 63. C. Feger, Personal Communication (1999). 64. G. D. S. , 3, 1043 (1998).
This acoustic wave mode penetrates to a depth of the material that depends on the frequency. The penetration can be adjusted so that wave motion reaches through the film-substrate interface and can provide information about the interface quality. - The method enables to measure the stiffness (Young's modulus) of the film material. The elastic stiffness of the film compared to the substrate essentially determines how the loading stresses are induced and distributed in the coated material. Therefore, the stiffness has an effect on the wear and adhesion properties of the film.